Table of Contents
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The following table illustrates this.
| Name of Input Device | Header | Z88 Input Chip | Input | Additional Target Signals | Name of Target Device | Target Chip | Target Footprint | |
|---|---|---|---|---|---|---|---|---|
ROM LH side | NEC 128K 8-bit static CMOS ROM. It is packaged in a 600-mil, 32-pin plastic DIP. | 2x16 SIL | uPD23C1001E | A0 - A16 D0 - D7 /CE /OE | A17 A18 | AMIC A29040CL-55F | AMIC A29040CL-55F | PLCC-32 Socket |
RAM RH side | NEC x8 Pseudo Static RAM (32K) | 2x16 SIL | uPD42832C | A0 - A16 | A17 A18 | BS62LV8001EIP55 IC, | BS62LV8001EIP55 | 44-pin TSOP II |
| SIL header | 3x1SIL | A17 A18 /CE Slot 1 |
Signals that are not used will be ignored.
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DIL or DIP packages are easier to handle and solder connecting wires to.
Here are some examples:-
 | 32 pin SOIC to DIL PCB |  | PLCC - 32 to DIL PCB |
 | 44 pin tsop to DIL PCB |  | SOP - 36 to DIL PCB |
| DIP-16 (0.3" body) to DIP-16 (0.6" body) adaptor (TH mount bottom pins) x 4 |
PCB footprint converters for the proposed chips have been ordered from Canada.
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The chips may not be manufactured any more but you may still find vintage parts suppliers being able to supply the on E-Bay and Chinese sites.
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