Flash Card moving to 3.3v Flash Chips

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DateFrom
31/08/17NoteThe 5v successor for the A29040C called A29040D has not appeared. See Future of 5v Flash Chips for more information
24/02/17 AMIC Technology

We are designing a successor for the A29040C called A29040D. This part will become available in Q2.
Its pin out , form factor and programming ID will be identical to its predecessor. So any design around the A29040C will be suitable for the A29040D.

In case you consider the 3 volt option we advise A29L040B which is also in design and will be released in Q3 this year.

All these new designs are necessary to transfer to new wafer processes allowing long term availability.
In either case we look forward to supply your design.

With best regards,

Rob
Mob: +31-6-531.589.49 – Desk +31-321-313.719 -- Skype:amicrobstuart -




Introduction

It has been around seven years since the current Flash card was designed. At that time it was done in a rush, without much research, as the AMD 1M chip was being withdrawn and the footprint for that device needed to be changed. As the footprint was a lot smaller, there was enough space on the PCB to add a 512K Flash and 1M RAM. The cost of manufacturing a PCB is based on the size of the card, if the 512K/512 Flash/RAM configuration worked or not, the cost would have been the same (although the workload in the design would have been a lot less!).

By a sheer coincidence, OZ 4.x was being developed at the same time and it was found that the INTEL chip could not run OZ 4.x but it could be used for storing files. What was NOT realised at that time was that the AMD 1M Flash chip, although was a lot better, it could also fail, when running OZ. This was not discovered until quite recently.

AMIC announced that the 512K Flash chip used was no longer being manufactured. That triggered this section to be written.

The purpose of this section is to compare the original 5v Flash chips with the 3.3v versions and to ensure that the next version addresses any outstanding issues.

PCB Improvements

There are changes that have been requested.

  • Real GOLD to be used on the card connector, instead of flash gold currently used.
  • Pads on the chips to be made larger for easier hand soldering.
  • 4 Layer board to be considered

Comparing different Flash chips 1M x 8

General Features

Footprint

TSOP 48

40 pin TSOP

Type / FunctionMX29LV800CS29AL008J

Am29F080B-85

Datasheet Version

Dec. 22, 2011
Rev. 2.6

December 11, 2015
Rev. *K

April 1997

PRELIMINARY

VCC Voltage Range

2.7V ~ 3.6V2.7V ~ 3.6V

5.0 Volt ± 5%

Access Time

55ns *1 /70ns

55ns *1 /70ns

85ns

Bus Width

X8 / x16X8 / x16X8

Boot Block

Top/BottomTop/Bottom

Sector Architecture

16KB+ 2*8KB+32KB
+ 15*64KB sectors.

16KB+ 2*8KB+32KB
+ 15*64KB sectors.


OTP Security Region

-256Byte

CFI Compliant

YesYes

Sector Protect/
Unprotect

YesYesYes

Temp Sector Protect/
Unprotect

YesYesYes

Erase Suspend/
Resume

YesYes

Hardware Reset# Pin

YesYes

WP# Pin

-Yes

Manufacture ID

C2h01h
Device ID Top/Bottom22DAh/225Bh22DAh/225Bh

Notes: 1. Restricted Vcc Voltage Range, Vcc = 3.0V ~ 3.6V.

Boot sector protect WP# input

The MX29LV800C and S29AL008J flash have virtually identical footprints and pinouts.

The only significant difference being the S29AL008J devices have a hardware WP# input (pin
#14 of the 48-TSOP package and pin B3 of the 48-BGA package) to protect the boot sector. These same pins are NC on the MX29LV800C devices. This difference will be transparent if the WP# pin is left unconnected or pulled high.

Command Set and Firmware

Basic commands and write status checking methods are the same for the chips shown above.

The Read operation and Write command could be used directly without any modification. Table below shows the command set in Word mode.

Basic Commands (Word Mode)

CommandReadResetProgramChip
Erase
Sector
Erase
Program/Erase
SuspendResume
1st Bus
Cycle

Addr

AddrXXX555h555h555hXXXXXX

Data

DataF0hAAhAAhAAhB0h30h

2nd Bus
Cycle

Addr

2AAh2AAh2AAh

Data

55h55h55h

3rd Bus
Cycle
Addr

555h555h555h

Data

A0h80h80h

4th Bus
Cycle
Addr

Addr555h555h

Data

DataAAhAAh

5th Bus
Cycle
Addr


2AAh2AAh

Data


55h55h

6th Bus
Cycle
Addr


555hSA

Data


10h30h

Note: SA: Sector Address

Electrical Characteristics

Read / Write Current

DC Characteristic

ConditionMX29LV800CS29AL008J
Read Current

typ @ 5MHz

7mA7mA

max @ 5MHz

12mA12mA
Standby Currenttyp0.2uA0.2uA
max5uA5uA
Write Currenttyp15mA20mA
max30mA30mA

Input / Output Voltage

DC Characteristic

ConditionMX29LV800CS29AL008J
Input Low Voltage

min

-0.5V-0.5V

max

0.8V0.8V
Input High Voltagemin0.7VCC0.7VCC
maxVCC+0.3VVCC+0.3V
Output Low Voltagemax0.45V0.45V
Output High Voltagemin0.85VCC0.85VCC
VHV Temporary Sector Unprotect Range11.5V ~ 12.5V8.5V ~ 12.5V

Erase and Programming Performance

AC Characteristic

SymbolDescriptionMX29LV800CS29AL008J
TaaRandom Read Access Time

VCC =3.0-3.6V

55ns-

VCC= 2.7-3.6V

70ns70ns
TceStandby CurrentVCC =3.0-3.6V55ns-
VCC= 2.7-3.6V70ns70ns
TcpChip Enable Pulse WidthVCC =2.7-3.6V35ns35ns

Write Function Performance (Program and Erase)

Write FunctionMX29LV800CS29AL008J
Byte Program Time9us6us
Accelerated Byte/Word Programming Time7us-
Chip Program Time Byte Mode

9s

6.3s

Sector Erase time

0.7s

0.5s

Chip Erase time

8s

10s

Manufacturer and Device ID Command Definitions (Word Mode)

Flash VenderManufacturer ID

Device ID


MX29LV800CS29AL008JMX29LV800C
S29AL008J
1st Bus
Cycle

Addr

555h555h555h
555h

Data

AAhAAhAAh
AAh

2nd Bus
Cycle

Addr2AAh2AAh2AAh
2AAh
Data55h55h55h
55h
3rd Bus
Cycle
Addr555h555h555h
555h
Data90h90h90h
90h
4th Bus
Cycle
AddrX00hX00hX01h
X01h
DataC2h01h

22DAh/225Bh


22DAh/225Bh

Note.
(1) Device ID can be read out after Manufacturer ID with proper address and does not need another command sequence.
(2) Use Reset command (F0h) to return to normal read mode.

Changing 5V to 3.3V

The following points to be considered

  • The supply voltage to be changed from 5v to 3..3V with a voltage regulator.
  • Signals levels to be converted with level converters.

Level Conversion

4 x GTL2003

1234567891011121314


GTL2003PW,118
 TSSOP-20
8bit Bi-Directional
GTL2003PW,118
 TSSOP-20
8bit Bi-Directional

NOT
REQUIRED 

A16A15A12A7A6A5A4A3A2A1A0D0D1D2SNSLGNDGND
1234567891011121314151617
15


1617181920212223242526272829303132

NOT REQUIRED
GTL2003PW,118
 TSSOP-20
8bit Bi-Directional
GTL2003PW,118
 TSSOP-20
8bit Bi-Directional
A14VPPVCCVCC/WEA13A8A9A11/POE/ROEA10/CED7D6D3D4D5A17A18A19
181920212223242526272829303132333435363738


TSOP pinouts

Am29F800B

48 pin TSOP

Am29F080B

40 pin TSOP

A29040BV

32 pin TSOP

A29040BV

32 pin TSOP

Am29F080B

40 pin TSOP

Am29F800B

48 pin TSOP

S29AL008J

48 pin TSOP

A15

    

A16


A14

A19  NC

BYTE#


A13

A18  NC

VSS 


A12

A17  

WE#

DQ15/A-1


A11

A16  

OE#

DQ7


A10

A15A11OE#

RY/BY#

DQ14


A9

A14

A9A10

DQ7

DQ6


A8

A13

A8CE#

DQ6

DQ13


NC 

A12

A13I/O7

DQ5

DQ5


NC 

CE#

A14I/O6

DQ4 

DQ12


WE#

VCC

A17I/O5

VCC

DQ4


RESET#

NC

WE#

I/O4

VSS

VCC


NC

RESET#

VCC

I/O3

 VSS

DQ11


NC

A11

A18VSS

DQ3 

DQ3


RY/BY#

A10

A16I/O2

DQ2

DQ10


A18

A9

A15I/O1

DQ1 

DQ2


A17

A8

A12I/O0DQ0 

DQ9


A7

A7

A7A0A0

DQ1


A6

A6

A6A1A1

DQ8


A5

A5

A5A2A2

DQ0


A4

A4

A4

A3A3

OE#


A3

    

VSS


A2

    

CE#


A1

    

A0


there is no standard using this package

DIL & PLCC Pinouts

LH SideRH Side 
A18VCC 
A16WE# 
A15A17 
A12A14 
A7A13 
A6A8 
A5A9 
A4A11 
A3OE# 
A2A10 
A1CE# 
A0I/O7 

I/O0

I/O6 
I/O1I/O5 
I/O2I/O4 
VSSI/O3 

All manufactures use this standard.

1M Flash 3v3

Being updated - not complete.

The following devices were available from

 DevicePackageManufacturerSectors 
S29AL008J48-Pin TSOP CYPRESS SEMICONDUCTOR

64 Kbyte
sectors


48-Pin TSOPCYPRESS SEMICONDUCTOR

64 Kbyte
sectors


48-Pin TSOPCYPRESS SEMICONDUCTOR

64 Kbyte
sectors


S29AL008J55TFIR10

48-Pin TSOPCYPRESS SEMICONDUCTOR

64 Kbyte
sectors


 

Spansion have been taken over by Cypress Semiconductor

512K Flash 3v3

The following device is available 23/02/17


DevicePackageManufacturerSectors

SST39SF040-70-4C-NHEPLCCMICROCHIP4
Kbyte

sectors

NOTE: The Z88 will not be able to program this chip due to the 4 Kbyte sectors. It may be programmed with an external programmer.

The following devices were available  

 DevicePackageManufacturerSectors 
A29040C-55FDIP 32AMIC

64 Kbyte
sectors

 


A29040CL-55FPLCCAMIC

64 Kbyte
sectors

 

The following devices were available  

 DevicePackageManufacturerSectors 
A29040B-70FDIP 32AMIC

64 Kbyte

sectors

 
A29L040AL-70FPLCCAMIC

64 Kbyte

sectors

 3v3

A29L400BUV-70F48 TSOPAMIC

64 Kbyte

sectors

 3v3
AM29F040B-55JFPLCCSPANSION

64 Kbyte

sectors

 
AM29F040B-90JFPLCCSPANSION

64 Kbyte

sectors

 
A29L040L-70FPLCCAMIC

64 Kbyte

sectors

 
SST39SF040-70-4C-NHEPLCCMICROCHIP

Uniform

4KByte

sectors

 
SST39SF040-70-4I-NHEPLCC 

Uniform

4KByte

sectors

 
SST39SF040-70-4I-WHE32 TSOP 

Uniform

4KByte

sectors

 

128K Flash 3v3

The following devices are available 27/07/2013

 DevicePackageManufacturerSectors 
A29010L-70FPLCCAMIC

64 Kbyte

sectors

 
A29010V-70F32 TSOPAMIC

64 Kbyte

sectors

 
AM29F010B-70JFPLCCSPANSION

64 Kbyte

sectors

 
SST39SF010A-70-4C-NHEPLCCMICROCHIP

Uniform

4KByte

sectors

 
SST39SF010A-70-4C-WHE32 TSOPMICROCHIP

Uniform

4KByte

sectors

 
SST39SF010A-70-4I-NHEPLCCMICROCHIP

Uniform

4KByte

sectors

 
SST39SF010A-70-4I-WHE32 TSOPMICROCHIP

Uniform

4KByte

sectors

 
SST39SF010A-70-4C-PHEDIP 32MICROCHIP

Uniform

4KByte

sectors

 

OR Gates

We might need an OR gate for /CE, POE to POE_S


DevicePackageManufacturer

ON SEMICONDUCTOR MC74VHC32DR2G

MC74VHC32DR2G SOICON SEMICONDUCTOR


Conclusion

  • There is no life left for the 1M Flash chips.
  • The 512K size was the most cost effective and the 64 sector version was manufactured two companies.
  • 128K is not a lot cheaper than the 512K and is uneconomic to use.


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