DECODER Chip Build

http://tinyurl.com/j7c2757

Connecting and Decoding the 512K/512K Flash/RAM Card

Using 5 NAND Gates to prove that there is a hardware problem was very useful, but for a production run using a single chip to replace these was the next step. This card is to replace the SO 16 74HC139 chip. This chip is removed (with C2) and this card connects to the SO 16 footprint.

Choosing a Decoder chip

Looking through the data sheets for a Texas Instruments VC1 chip found the following timings:-

Part NoChipManufactureSpeed nS
PackageDrawingmmPrice



MinTypMax


Pad PitchPad widthLength
1741279

SN74LVC1G139DCTR

Ti

<2.5
SM8DCT0.650.34.25$ 0.69

SN74LVC1G139DCUTTi / Farnell

<2.5
VSSOPDCU0.500.253,20£0.403

The 2-to-4 Line Decoder display fast times.

Here is the chip that has been chosen:-


PART NUMBERPACKAGEBODY SIZE (NOM)
SN74LVC1G139DCTSM8 (8)2.95 mm × 2.80 mm
SN74LVC1G139DCUVSSOP (8)2.30 mm × 2.00 mm

Full Data Sheet for SN74LVC1G139 2-to-4 Line Decoder & Timing

This chip on its own provides the logic for the Z88 application.

There are 2 inputs,

  • A19 - Selects either the top half of the 1M memory space for the flash chip or the bottom half for the RAM using the A input.
  • /CE - Selects this chip.

Truth Table of Decode Chip

InputsOutputs
B
/CE 
A
A19 
/Y1
/CE1 FLASH 
/Y0
/CE0 RAM 
0010
0101
1X11

Circuit Diagram using 2-to-4 Line Decoder

Updated 17/11/2016


Building the circuit on a breadboard externally

Components required

2 MSOP-8 AND 1 VSOP to IC adaptors were obtained in addition to the 5 2-to-4 Line Decoder chips.
This circuit could now be bread-boarded and tested outside the Z88 card case.

The four signal and power lines can be seen connecting the card to the breadboard.

The Games play without crashing.

Oscilloscope Readings

This produced the signals required.

This trace shows the Flash chip being selected (/CE1) in 3nS.

The RAM (/CE) would be the same timings.

Signals not the same abbreviations as the circuit

The names of the signals on the scope are not all the same as shown in the circuit.

SignalScopeCircuit
A19A19A19
/CE1_CE1/CE1
/CE0_CE/CE0

Printed Circuit Board

Main points

  • Small holes 0.47 mm are drilled in the centre of the pads of H1,so that wire links may be used to connect the signals from the 512K/512K card to the PCB.
  • The pads of the footprint of the SOT-23-5 have been made longer, to enable easier soldering of the small parts.
  • The bottom Left Hand corner of the PCB matches the shape of the 512K/512K Card for easy alignment.

Final Layout

Boards ordered 24/11/16. ETA 1/12/16

The one pixel blue line for the board size is difficult to see.

Size of board 23.11 x15 mmLayout with SO 16 footprint overlaid

The final layout.Holes line up with the pads that need to be soldered
The 7 layersLayout over the original PCB

Here are the layers as a pdf file.
Zooming in is generally helpful.
Area of the original card the board will cover.
C2 needs to be removed (if fitted).
3D View of Card Bottom3D View of Card Top

42 Actual PCBs (without screen printing)


PCB fitted to 512K/512K Flash/RAM CardConnecting PCB to 512/512K Card


Two additional functions of this card were considered

SO 16 to 16 pin DIL converter

A converter card using this PCB was considered as

  • H1 contains the footprint of the SO 16 with small holes allowing wires to connect to the pads on the main PCB.
  • H2 is the footprint of a 16 pin DIL.

These ware connected together allowing the card to be used as a convertor. A 16 pin DIL device may be piggybacked on top of this card.

Conclusion

Impractical to connect directly to SO 16 pads

This proved to be impractical solution. The holes were too small to connect to the SO16 pads. Flying wires soldered directly to the pads using the 16 pin DIL holes to connect to the PCB worked. Another method may need to be considered should this facility be needed.







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